'Smart cut': a promising new SOI material technology

IEEE International SOI Conference

Volumn , Issue , 1995, Pages 178-179

  Bruel, M ^a   Aspar, B ^a   Charlet, B ^a   Maleville, C ^a   Poumeyrol, T ^a   Soubie, A ^a   Auberton Herve, A J ^a   Lamure, J M ^a   Barge, T ^a   Metral, F ^a   Trucchi, S ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CRYSTALLINE MATERIALS; CRYSTALLOGRAPHY; ELECTRIC BREAKDOWN; HEAT TREATMENT; HYDROGEN; INFRARED SPECTROSCOPY; ION IMPLANTATION; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; TRANSMISSION ELECTRON MICROSCOPY;

CRYSTALLOGRAPHIC CHARACTERIZATION; HIGH TEMPERATURE TREATMENT PHASE; HYDROPHILIC BONDING; MONOCRYSTALLINE SILICON; SEPARATION BY IMPLANTED OXYGEN; X RAY TOPOGRAPHY;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0029492255     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)