Stress analysis of thermal inclusions with interior voids and cracks

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 3, 2000, Pages 192-199

  Ru, C Q ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002739757     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1286020     Document Type: Article

References (23)

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