Thermosonic flip chip bonding system with a self-planarization feature using polymer

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1318-1325

  Tan, Qing ^a   Schaible, B ^a   Bond, L J ^a   Lee, Y C ^a  

^a University of Colorado at Boulder   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELASTIC MODULI; ENERGY EFFICIENCY; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; NETWORK COMPONENTS; POLYMERS; BONDING; MATHEMATICAL MODELS; OPTIMIZATION; ULTRASONICS;

ENERGY TRANSMISSION EFFICIENCIES; FLIP CHIP ASSEMBLIES; POLYMER THICKNESS; SELF-PLANARIZATION; SOLDERING TECHNOLOGY; THERMO-SONIC BONDING; THERMOSONIC FLIP-CHIP BONDING; WIRE BONDING TECHNOLOGY;

BONDING; FLIP CHIP DEVICES;

THERMOSONIC FLIP CHIP BONDING; ULTRASONIC ENERGY DISTRIBUTION; WIRE BONDING TECHNOLOGY;

EID: 0031620447     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678915     Document Type: Conference Paper

References (16)

1. Atsumi, K., Kashima, N., Maehara, Y., Mitsuhashi, H., Komatsu, T., Ochiai, N., 1989, "Inner Lead Bonding Techniques for 500 Lead Dies have a 90um Lead Pitch", Proceedings of IEEE 39th ECC. Houston, TX, pp. 171-176.
2. Chen, W. T., Rashi, J. Z., Young, J. R., Teneketges, N. A., 1991, "A Fundamental Study of the Tape Automated Bonding Process, " Journal of Electronic Packaging, Vol. 113, No. 9.
3. Ching, T. B., Schroen W. H. 1988, "Bond Pad Structure Reliability", Proc. IEEE/IRPS, pp. 64-70.
4. Clatterbaugh G. V., Charles H. K., 1990, "The Effect of High-Temperature Intermetallic Growth on Ball Shear-Induced Cratering", IEEE Tran. CHMT, Vol. 13, No. 1, pp. 167-175.
5. Harman, G. G., Leedy, K. O., 1972, "An Experimental Model of the Microelectronic Ultrasonic Wire Bonding Mechanism, " Proc. 10th Reliability Physics Symp., pp. 49-56.
6. Hueners, B. M., 1983, "Absolute Ultrasonic Amplitude Measurement, Calibration and Troubleshooting of a Wire Bonding Using Laser Interferometer, " Proc. ISHM Annual Conf.
7. Kang, S. Y. 1995, Modeling and Experimental Studies on Thermosonic flip chip Bonding". Ph. D thesis, Department of Mechanical Engineering, University of Colorado at Boulder.
8. Kang, S. Y. Williams. P. M., Lee. Y. C., 1993, "Modeling and Experimental Studies on Thermosonic Flip Chip Bonding", IEEE Trans. CHMT, Part B. Vol. 18, No. 4, pp. 728-733.
9. Kang, S. Y., Xie, H., Lee, Y. C., 1993, "Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process", Journal of Electronic Packaging, Vol. 115, No. 3, pp. 63-70.
10. Martin, B. D., 1976, "Design and Use of a Laser Interferometer for Ultrasonic Bonding Studies, " Proc. 14th Reliability Physics Symp., pp. 82-85.
11. McLaren, S. H., Kang, S. Y., Zhang, W., Lee, Y. C., 1994, "Thermosonic Bonding for Flip Chip Assembly", Adv. Microelectronics, Vol. 21, No. 4, pp. 14-16.
12. Mclaren, T. S., Kang, S. Y., Zhang, W., Hellman, D. Ju T. H., Lee, Y. C., 1997: "Thermosonic Bonding of an Optical Transceiver Based on an 8x8 Vertical Surface Emitting Laser Array", IEEE Trans, on Components, Packaging, Manufacturing Technology, Part B, pp. 152-160, May.
13. Takahashi, Y., Shibamoto S., Inoue, K., 1996, "Numerical Analysis of the Interfacial Contact Process in Wire Thermocompression Bonding, " IEEE Tran. CPMT, Vol. 19, No. 2, pp. 213-223.
14. Tan, Q., Zhang, W., Schaible, B., Bond, L. J., Ju T. H., Lee, Y. C., 1997, : "Thermosonic Flip Chip Bonding Using Longitudinal Ultrasonic vibration", IEEE Tran. CPMT, February.
15. Joshi K. C., 1971, "The Formation of Ultrasonic Bonding Between Metal", Welding Journal, Vol. 50, pp. 840-848, Aug.
16. Winkle, R. V., 1979, "A New Method of Quality Control for Ultrasonic Wire Bonding, " Ultrasonic International, pp. 62-68.