A thermal microprobe fabricated with wafer-stage processing

Review of Scientific Instruments

Volumn 69, Issue 5, 1998, Pages 2081-2084

  Zhang, Yongxia ^a,d   Zhang, Yanwei ^a   Blaser, Juliana ^b   Sriram, T S ^b   Enver, Ahsan ^b   Marcus, R B ^c  

^a NEW JERSEY INSTITUTE OF TECHNOLOGY   (United States)

^b HEWLETT PACKARD COMPANY   (United States)

^c Murray Hill Devices Inc   (United States)

^d MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0008447209     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1148902     Document Type: Article

References (12)

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