Applications of a 3-D field solver for on-chip and package microstrip interconnection design

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 198-203

  Ryu, Woonghwan ^a,b   Wai, A L C ^a   Wei, Fan ^a   Kim, Joungho ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Bandwidth; Design methodology; Electromagnetic analysis; Electromagnetic radiation; Electromagnetic scattering; Electronics packaging; Integrated circuit packaging; Microstrip; Performance analysis; Radio frequency

Indexed keywords

BANDWIDTH; CHIP SCALE PACKAGES; DESIGN; ELECTROMAGNETIC WAVES; ELECTRONICS PACKAGING; MICROSTRIP LINES; RADIATION EFFECTS; TUNGSTEN;

DESIGN METHODOLOGY; ELECTROMAGNETIC ANALYSIS; ELECTROMAGNETIC SCATTERING; INTEGRATED CIRCUIT PACKAGING; MICROSTRIPES; PERFORMANCE ANALYSIS; RADIO FREQUENCIES;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 0008148362     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906373     Document Type: Conference Paper

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