Manufacturability of underfill processing for low cost flip chip

American Society of Mechanical Engineers, EEP

Volumn 21, Issue , 1997, Pages 21-31

  Baldwin, Daniel F ^a   Pascarella, Nathan W ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; COST EFFECTIVENESS; ELECTRONICS PACKAGING; PRODUCTIVITY; SURFACE MOUNT TECHNOLOGY; VACUUM APPLICATIONS;

COMPRESSION FLOW; FLIP CHIP ON BOARD (FCOB) PROCESSING; INJECTION FLOW; MANUFACTURABILITY; UNDERFILL PROCESSING;

FLIP CHIP DEVICES;

EID: 0031368311     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)