Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 1, 1999, Pages 54-59

  Wong, C P ^a   Bollampally, Raja S ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Composites; Encapsulants; Packaging; Polymer; Thermal conductivity

Indexed keywords

EID: 0002061903     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.746543     Document Type: Article

References (14)

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