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Volumn , Issue , 1992, Pages 246-252
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Effect of mold compound thermal conductivity on IC package thermal performance
a
a
NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
HEAT DISSIPATION;
HEAT TRANSFER;
INTEGRATED CIRCUITS;
PLASTICS MOLDING;
THERMAL ANALYSIS;
THERMAL CONDUCTIVITY OF SOLIDS;
EPOXY MOLDING;
PLASTIC IC PACKAGES;
THERMOANALYSIS;
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EID: 0027091748
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (19)
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References (10)
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