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Volumn , Issue , 1996, Pages 343-346
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High thermal conductance liquid encapsulants for direct chip attach
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM COMPOUNDS;
BORON COMPOUNDS;
ENCAPSULATION;
EPOXY RESINS;
FILLER METALS;
HEAT LOSSES;
MECHANICAL PROPERTIES;
RHEOLOGY;
SEMICONDUCTING POLYMERS;
SEMICONDUCTOR DEVICE MANUFACTURE;
THERMAL CONDUCTIVITY;
VISCOSITY;
ALUMINUM NITRIDE;
BALL GRID ARRAYS;
BORON NITRIDE;
HIGH CONDUCTIVITY FILLERS;
QUAD FLAT PACKS;
SILICON CARBON LIQUID SYSTEM;
TAPE CARRIER PACKAGES;
THERMAL CONDUCTANCE LIQUID ENCAPSULANTS;
THERMAL MANAGEMENT;
ELECTRONICS PACKAGING;
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EID: 0029698413
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (8)
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References (10)
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