Moisture resistant aluminum nitride filler for high thermal conductivity microelectronic molding compounds

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 335-342

  Gallo, Anthony A ^a   Bischof, Charles S ^a   Howard, Kevin E ^a   Dunmead, Stephen D ^a   Anderson, Stephen A ^a  

^a DOW CHEMICAL

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; EPOXY RESINS; FILLER METALS; FINITE ELEMENT METHOD; METAL MOLDING; MOISTURE; SEMICONDUCTING ALUMINUM COMPOUNDS; SILICA; STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL VARIABLES MEASUREMENT;

BIPHENYL RESIN; FUSED SILICA SYSTEMS; HIGH THERMAL CONDUCTIVITY MICROELECTRONIC MOLDING COMPOUNDS; MOISTURE RESISTANT ALUMINUM NITRIDE FILLER; TRANSIENT THERMAL STRESS;

MICROELECTRONIC PROCESSING;

EID: 0029696517     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)