Thermal Conductivity Of Molding Compounds For Plastic Packaging

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 17, Issue 4, 1994, Pages 527-532

  Ino, S ^b   Shiobara, T ^b  

^a CIBA GEIGY LTD   (Switzerland)

^b SHIN ETSU CHEMICAL CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; EPOXY RESINS; FILLERS; PLASTICS FORMING; QUARTZ; SILICA; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

PLASTIC PACKAGING; WATER UPTAKE;

SHEET MOLDING COMPOUNDS;

EID: 0028757083     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.335037     Document Type: Article

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