Electromigration-induced compressive stresses in encapsulated thin-film conductors

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1991, Pages 64-69

  Hemmert, R S ^a   Costa, M ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON NITRIDE; STRESSES; TRANSISTORS;

ELECTROMIGRATION; THIN FILM CONDUCTORS;

ELECTRIC CONDUCTORS;

EID: 0026139325     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (33)