Miniaturized millimeter-wave hybrid IC technology using non-photosensitive multi-layered BCB thin films and stud bump bonding

IEICE Transactions on Electronics

Volumn E82-C, Issue 11, 1999, Pages 2029-2037

  Takahashi, Kazuaki ^a   Ogura, Hiroshi ^a   Sagawa, Morikazu ^a  

^a Matsushita Research Institute Tokyo Inc   (Japan)

Author keywords

BCB; flip chip bonding; micro bump; millimeter wave; multi layer; stud bump

Indexed keywords

EID: 0001119753     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (23)

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