Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs- and Si-MMIC's

IEEE Journal of Solid-State Circuits

Volumn 32, Issue 9, 1997, Pages 1334-1340

  Tokumitsu, Tsuneo ^a,b   Hirano, Makoto ^a,b   Yamasaki, Kimiyoshi ^a,b   Yamaguchi, Chikara ^b   Nishikawa, Kenjiro ^a,b   Aikawa, Masayoshi ^a,b  

^a IEEE   (Japan)

^b NTT CORPORATION   (Japan)

Author keywords

GaAs; Masterslice; MMIC; Polyimide; Receiver; Si; Three dimensional

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; MESFET DEVICES; POLYIMIDES; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS;

NOISE FIGURE;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0031237392     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/4.628736     Document Type: Article

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