Molecular dynamics studies of silica wafer bonding

Journal of Applied Physics

Volumn 85, Issue 5, 1999, Pages 2627-2635

  Timpel, Dirk ^a   Schaible, Max ^a   Scheerschmidt, Kurt ^a  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000658913     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.369579     Document Type: Article

References (29)

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