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Volumn 35, Issue 2 PART 1, 1999, Pages 993-999

Precision positioning using a microfabricated electrostatic actuator

Author keywords

Actuator; Disk drive; Micro electrome chanical systems; Position control

Indexed keywords


EID: 0000526124     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/20.753822     Document Type: Article
Times cited : (80)

References (12)
  • 1
    • 0029327467 scopus 로고
    • Magnetic Recording-Head Positioning at Very High Track Densities Using a Microactuator-Based, Two-Stage Servo System
    • June
    • L.-S. Fan, H.H. Ottesen, T.C. Reiley, R.W. Wood, "Magnetic Recording-Head Positioning at Very High Track Densities Using a Microactuator-Based, Two-Stage Servo System", IEEE Trans. Ind. Electronics, v 42, pp. 222-233, June 1995.
    • (1995) IEEE Trans. Ind. Electronics , vol.42 , pp. 222-233
    • Fan, L.-S.1    Ottesen, H.H.2    Reiley, T.C.3    Wood, R.W.4
  • 4
    • 0029755924 scopus 로고    scopus 로고
    • Transverse Mode Electrostatic Microactuator for MEMS-Based HDD Slider
    • San Diego, CA
    • T. Imamura, T. Koshikawa, M. Katayama, "Transverse Mode Electrostatic Microactuator for MEMS-Based HDD Slider," Proc. 9th Int. Conf. on MEMS (MEMS '96), San Diego, CA, pp. 216-221, 1996.
    • (1996) Proc. 9th Int. Conf. on MEMS (MEMS '96) , pp. 216-221
    • Imamura, T.1    Koshikawa, T.2    Katayama, M.3
  • 5
    • 0030655635 scopus 로고    scopus 로고
    • Stabilization of Electrostatically Actuated Mechanical Devices
    • Chicago, IL, 16-19 June New York, NY
    • J.I Seeger, S.B. Crary, "Stabilization of Electrostatically Actuated Mechanical Devices," Proc. Intl. Conf. on Solid-State Sensors and Actuators, Chicago, IL, 16-19 June 1997, New York, NY, pp. 1133-1136 vol.2.
    • (1997) Proc. Intl. Conf. on Solid-State Sensors and Actuators , vol.2 , pp. 1133-1136
    • Seeger, J.I.1    Crary, S.B.2
  • 6
    • 0025559263 scopus 로고
    • Squeeze Film Damping in Solid State Accelerometers
    • Hilton Head, SC, June
    • J.B Starr, "Squeeze Film Damping in Solid State Accelerometers," Proc. 1990 Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 44-47, June 1990.
    • (1990) Proc. 1990 Solid-State Sensor and Actuator Workshop , pp. 44-47
    • Starr, J.B.1
  • 10
    • 0030659231 scopus 로고    scopus 로고
    • Batch Transfer of Microstructures using Flip-Chip Solder Bump Bonding
    • Chicago, IL
    • A. Singh, D.A. Horsley, M.B. Cohn, A.P. Pisano, R.T. Howe, "Batch Transfer of Microstructures using Flip-Chip Solder Bump Bonding," Transducers '97, Chicago, IL, pp. 265-268.
    • Transducers '97 , pp. 265-268
    • Singh, A.1    Horsley, D.A.2    Cohn, M.B.3    Pisano, A.P.4    Howe, R.T.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.