Precision positioning using a microfabricated electrostatic actuator

IEEE Transactions on Magnetics

Volumn 35, Issue 2 PART 1, 1999, Pages 993-999

  Horsley, David A ^a,b   Wongkomet, Naiyavudhi ^a   Horowitz, Roberto ^a   Pisano, Albert P ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b DiCon Fiberoptics ^*  (United States)

Author keywords

Actuator; Disk drive; Micro electrome chanical systems; Position control

Indexed keywords

EID: 0000526124     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/20.753822     Document Type: Article

References (12)

1. L.-S. Fan, H.H. Ottesen, T.C. Reiley, R.W. Wood, "Magnetic Recording-Head Positioning at Very High Track Densities Using a Microactuator-Based, Two-Stage Servo System", IEEE Trans. Ind. Electronics, v 42, pp. 222-233, June 1995.
2. D.A. Horsley, A. Singh, R. Horowitz, A.P. Pisano, "Angular Micropositioner for Disk Drives," Proc. 10th Intl. Conf. on MEMS (MEMS '97), Nagoya, Japan, pp. 454-459, 1997.
3. W.C. Tang, "Electrostatic Comb Drive for Resonant Sensor and Actuator Applications ", Ph.D. Dissertation, University of California at Berkeley, May 1990.
4. T. Imamura, T. Koshikawa, M. Katayama, "Transverse Mode Electrostatic Microactuator for MEMS-Based HDD Slider," Proc. 9th Int. Conf. on MEMS (MEMS '96), San Diego, CA, pp. 216-221, 1996.
5. J.I Seeger, S.B. Crary, "Stabilization of Electrostatically Actuated Mechanical Devices," Proc. Intl. Conf. on Solid-State Sensors and Actuators, Chicago, IL, 16-19 June 1997, New York, NY, pp. 1133-1136 vol.2.
6. J.B Starr, "Squeeze Film Damping in Solid State Accelerometers," Proc. 1990 Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 44-47, June 1990.
7. Y.H. Cho, B.M. Kwak, A.P. Pisano, R.T. Howe, "Slide Film Damping in Laterally Driven Microstructures", Sensors and Actuators A, 40, 1994, pp. 31-39.
8. R.J. Roark, W. C. Young, "Formulas for Stress and Strain", 5th ed, pp. 118-127.
9. C.G. Keller and M. Ferrari, "Milli-Scale Polysilicon Structures," 1994 Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 132-137.
10. A. Singh, D.A. Horsley, M.B. Cohn, A.P. Pisano, R.T. Howe, "Batch Transfer of Microstructures using Flip-Chip Solder Bump Bonding," Transducers '97, Chicago, IL, pp. 265-268.
11. N. Wongkomct, D.A. Horsley, B. Boser, "A Capacitive Position Sensing Circuit for Microactuators," to appear at 12th European Conf. on Solid-State Transducers, Southampton, UK, Sept. 1998.
12. B.C. Kuo, Automatic Control Systems, 6th ed., New Jersey: Prentice Hall, 1991, pp. 669-691.