Interconnect and substrate modeling and analysis: An overview

IEEE Journal of Solid-State Circuits

Volumn 33, Issue 9, 1998, Pages 1445-1452

  Chiprout, Eli ^{a,b,c,d,e,f,g}  

^a IEEE   (United States)

^b IBM AUSTIN RESEARCH LABORATORY   (United States)

^c MCGILL UNIVERSITY   (Canada)

^d CARLETON UNIVERSITY   (Canada)

^e Mitel Semiconductor   (United States)

^f IBM T J WATSON RESEARCH CENTER   (United States)

^g Austin Research Lab   (United States)

Author keywords

Electromagnetic analysis; Hybrid integrated circuit interconnections; Integrated circuit modelling

Indexed keywords

EID: 0000453553     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/4.711346     Document Type: Review

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