Selection criteria for sealing glasses for SiC packaging

Journal of Non-Crystalline Solids

Volumn 347, Issue 1-3, 2004, Pages 173-179

  Guinel, Maxime J F ^a   Norton, M Grant ^a  

^a Washington State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON MONOXIDE; ELECTRONICS PACKAGING; FIBER REINFORCED MATERIALS; FREE ENERGY; HIGH TEMPERATURE APPLICATIONS; MICROELECTRONICS; MILLING (MACHINING); PARTIAL PRESSURE; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SEALANTS; SEALING (CLOSING); SILICON CARBIDE; STRESS RELAXATION; THERMAL EXPANSION; THERMODYNAMICS;

COEFFICIENT OF THERMAL EXPANSION (CTE); GLASS COMPOSITION; SEALING GLASSES;

GLASS;

EID: 9644287983     PISSN: 00223093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jnoncrysol.2004.09.002     Document Type: Article

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