Bottom coverage of Cu deposit for 200-nm-class circular vias with high aspect ratios investigated by magnetron sputtering activated using superconducting bulk magnet

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 9 A, 2004, Pages 6026-6031

  Hazama, Hirofumi ^a   Matsuda, Takashi ^b   Mizutani, Uichiro ^c   Ikuta, Hiroshi ^c   Yanagi, Yousuke ^d   Itoh, Yoshitaka ^d   Sakurai, Kazuo ^e   Sekiguchi, Atsushi ^e   Imai, Atsuo ^a  

^a NAGOYA INDUSTRIAL SCIENCE RESEARCH INSTITUTE   (Japan)

^b DIAX Co Ltd   (Japan)

^c NAGOYA UNIVERSITY   (Japan)

^d Aisin Cosmos R and D Co   (Japan)

^e ANELVA Corp ^*  (Japan)

Author keywords

Bottom coverage; Cu sputtering; Long throw distance; Low pressure; Magnetron sputtering; RE Ba Cu O bulk magnet

Indexed keywords

ASPECT RATIO; MAGNETIZATION; MAGNETRON SPUTTERING; PERMANENT MAGNETS; PLASMAS; REFRIGERATORS; SUPERCONDUCTING MAGNETS;

BOTTOM COVERAGE; CU SPUTTERING; LONG THROW DISTANCE; LOW PRESSURE; RE-BA-CU-O BULK MAGNET;

COPPER;

EID: 9244263036     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.6026     Document Type: Article

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