Selective silicidation of Co using silane or disilane for anti-oxidation barrier layer in Cu metallization

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 9 A, 2004, Pages 6001-6007

  Noda, Suguru ^a   Hirai, Rika ^a   Komiyama, Hiroshi ^a   Shimogaki, Yukihiro ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

Cobalt suicide; Conductive passivation layer; Copper metallization; Disilane; Selective silicidation; Silane

Indexed keywords

ANTIOXIDANTS; COPPER; DIFFUSION; METALLIZING; PASSIVATION; SILANES; X RAY PHOTOELECTRON SPECTROSCOPY;

COBALT SILICIDE; CONDUCTIVE PASSIVATION LAYER; COPPER METALLIZATION; DISILANE; SELECTIVE SILICIDATION;

COBALT;

EID: 9144260860     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.6001     Document Type: Article

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