Manufacturing-ready selectivity of CoWP capping on damascene copper interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 567-572

  Segawa, Yuji ^a   Horikoshi, Hiroshi ^a   Ohtorii, Hiizu ^a   Tai, Kaori ^a   Komai, Naoki ^a   Sato, Shuzo ^a   Takahashi, Shingo ^a   Ohoka, Yutaka ^a   Yasuda, Zenya ^a   Ishihara, Masao ^a   Yoshio, Akira ^a   Nogami, Takeshi ^a  

^a SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CAPACITANCE; COBALT COMPOUNDS; COPPER; DIELECTRIC MATERIALS; DIFFUSION IN SOLIDS; ELECTROLESS PLATING; ELECTROMIGRATION; METALLIC FILMS; SILICON WAFERS;

CAPPING TECHNOLOGY;

INTERCONNECTION NETWORKS;

EID: 0035555211     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)