The peeling moment-A key rule for delamination resistance in I.C. Assemblies

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 106-109

  Moore, Thomas D ^a   Jarvis, John L ^b  

^a ANALOG DEVICES   (Ireland)

^b UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; INTERFACES (MATERIALS); RISK ASSESSMENT; SHEAR STRESS; THERMOMECHANICAL TREATMENT;

BIMATERIAL BEAMS; FREE ENDS; MAGNITUDE; PEELING STRESSES;

INTEGRATED CIRCUIT LAYOUT;

EID: 8744281380     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1649240     Document Type: Article

References (11)

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3. Hess, M. S., 1969, "The End Problem for a Laminated Elastic Strip-II. Differential Expansion Stresses," J. Compos. Mater., 3, pp. 630-641.
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5. Suhir, E., 1986, "Stresses in Adhesively Bonded Bi-material Assemblies Used in Electronic Packaging," Electronic Packaging Materials Science 1986, Materials Research Soc., pp. 133-138.
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8. Mirman, I. B., 1991, "Effects of Peeling Stresses in Bimaterial Assembly," ASME J. Electron. Packag., 113, pp. 431-433.
9. Moore, T. D., and Jarvis, J. L., 2003, "A Simple and Fundamental Design Rule for Resisting Delamination in Bimaterial Structures," Microelectron. Reliab.s, 43, pp. 487-494.
10. Gektin, V., Bar-Cohen, A., and Witzman, S., 1998, "Coffin-Manson Based Fatigue Analysis of Underfilled DCAs," IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21, pp. 577-584.
11. Moore, T. D., and Jarvis, J. L., 2004, "Peeling in Bimaterial Beams-The Peeling Moment and Its Relation to the Differential Rigidity." ASME J. Appl. Mech., 71, in press.