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Volumn 71, Issue 2, 2004, Pages 290-292

Peeling in bimaterial beams: The peeling moment and its relation to the differential rigidity

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; ELASTICITY; PEELING; STIFFNESS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

EID: 8744228784     PISSN: 00218936     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1651092     Document Type: Article
Times cited : (9)

References (6)
  • 1
    • 0037370259 scopus 로고    scopus 로고
    • A simple and fundamental design rule for resisting delamination in bimaterial structures
    • Moore, T. D., and Jarvis, J. L., 2003, "A Simple and Fundamental Design Rule for Resisting Delamination in Bimaterial Structures," Microelectron. Reliab., 43(3), pp. 487-494.
    • (2003) Microelectron. Reliab. , vol.43 , Issue.3 , pp. 487-494
    • Moore, T.D.1    Jarvis, J.L.2
  • 2
    • 0001764380 scopus 로고
    • Analysis of bi-metal thermostats
    • Timoshenko, S., 1925, "Analysis of Bi-metal Thermostats," J. Opt. Soc. Am., 11(Sept.), pp. 233-255.
    • (1925) J. Opt. Soc. Am. , vol.11 , Issue.SEPT. , pp. 233-255
    • Timoshenko, S.1
  • 3
    • 0022787978 scopus 로고
    • Stresses in bi-metal thermostats
    • Suhir, E., 1986, "Stresses in Bi-metal Thermostats," ASME J. Appl. Mech., 53, pp. 657-660.
    • (1986) ASME J. Appl. Mech. , vol.53 , pp. 657-660
    • Suhir, E.1
  • 4
    • 0024734854 scopus 로고
    • Interfacial stresses in bi-metal thermostats
    • Suhir, E., 1989, "Interfacial Stresses in Bi-metal Thermostats," ASME J. Appl. Mech., 56, pp. 595-600.
    • (1989) ASME J. Appl. Mech. , vol.56 , pp. 595-600
    • Suhir, E.1
  • 5
    • 0013363608 scopus 로고    scopus 로고
    • Interfacial thermal stresses in bimaterial beams: Modified beam models revisited
    • Ru, C. Q., 2002, "Interfacial Thermal Stresses in Bimaterial Beams: Modified Beam Models Revisited," ASME J. Electron. Packag., 124, pp. 141-146.
    • (2002) ASME J. Electron. Packag. , vol.124 , pp. 141-146
    • Ru, C.Q.1
  • 6
    • 0035328922 scopus 로고    scopus 로고
    • Failure analysis and stress simulation in small multichip BGAs
    • Moore, T. D., and Jarvis, J. L., 2001, "Failure Analysis and Stress Simulation in Small Multichip BGAs," IEEE Trans. Adv. Packag., 24(2), pp. 216-223.
    • (2001) IEEE Trans. Adv. Packag. , vol.24 , Issue.2 , pp. 216-223
    • Moore, T.D.1    Jarvis, J.L.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.