Direct deposition of Cu\barrier stacks on dielectric/nonconductive layers using supercritical CO2

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 33-35

  Kondoh, E ^a   Hishikawa, M ^a   Yanagihara, M ^a   Shigama, K ^a  

^a UNIVERSITY OF YAMANASHI   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON DIOXIDE; DIELECTRIC MATERIALS; ELECTROCHEMISTRY; ELECTRODEPOSITION; LSI CIRCUITS; METALLIZING; SPUTTERING; SUPERCRITICAL FLUIDS; ULSI CIRCUITS;

MOLECULAR NUMBER DENSITY; NANOLAYERS; NONCONDUCTIVE LAYERS; SURFACE CATALYZED REACTIONS;

COPPER;

EID: 8644275576     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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