Stress analysis of surface-mount interconnections due to vibrational loading

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 3, 1997, Pages 183-188

  Darbha, K ^a   Ling, S ^a   Dasgupta, A ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; DEFORMATION; EIGENVALUES AND EIGENFUNCTIONS; FATIGUE OF MATERIALS; PRINTED CIRCUIT BOARDS; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; VIBRATIONS (MECHANICAL);

RAYLEIGH RITZ APPROACH; SURFACE MOUNT INTERCONNECTS;

SOLDERED JOINTS;

EID: 0031236398     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792232     Document Type: Article

References (7)

1. Blank, H. S., 1976, “Accelerated Vibration Fatigue Life Testing of Leads and Solder Joint,” Microelectronics and Reliability, Vol. 15, pp. 213-219.
2. Cook, R. D., Malleus, D. S., and Plesha, M. P., Concepts and Applications of Finite Element Analysis, 2nd Ed., John Wiley & Sons, Inc., New York.
3. Darbha, K, Ling, S., and Dasgupta, A., 1996, ‘ ‘Stress Analysis of Surfacemount Interconnects Due to Vibrational Loading,” Proceedings of the 1996 ASME International Mechanical Engineering Congress and Exhibition, EEP-14.
4. Dasgupta, A., Ling, S., and Verma, S., 1993, “A Generalized Stress Analysis Model for Fatigue Prediction of Surface Mount Solder Joints,” Proceedings of the 1993 ASME International Electronics Packaging Conference, Vol. 1, pp. 979-986.
5. Lau, J., Gratalo, K., and Schneider, E., 1995, “Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions,” Circuit World, Vol. 22, pp. 27-32.
6. Ling, S., and Dasgupta, A., 1995, “A Multi-Domain Stress Analysis Method for Surface-Mount Solder Joint,” INTERPack’95, Proceedings of ASME International, Intersociety Electronics Packaging Conference and Exhibition, T. R. Hsu et al., eds., Lahaina, Maui, Hawaii.
7. Suhir, E., 1988, “Could Compliant External Leads Reduce the Strength of a Surface-Mounted Device?,” 1988 Proceedings: 38th Electronic Components Conference, May 9-11, 1988, Los Angeles, CA, pp. 1-6