51 GHz frontend with flip chip and wire bond interconnections from GaAs MMICs to a planar patch antenna

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 1995, Pages 1639-1642

  Baumann, G ^a   Richter, H ^a   Baumgaertner, A ^a   Ferling, D ^a   Heilig, R ^a   Hollmann, D ^a   Mueller, H ^a   Nechansky, H ^a   Schlechtweg, M ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNAS; COMPUTER SIMULATION; ELECTRIC VARIABLES MEASUREMENT; ELECTRIC WIRING; FLIP CHIP DEVICES; FREQUENCIES; MICROWAVE AMPLIFIERS; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES; WAVEGUIDES;

FLIP CHIP INTERCONNECT; LOW NOISE AMPLIFIER; METALLIC LID; PLANAR PATCH ANTENNA; WIRE BOND INTERCONNECTIONS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0029237554     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)