40 μm silver flip-chip interconnect technology with solid-state bonding

Journal of Electronic Packaging, Transactions of the ASME

Volumn 133, Issue 3, 2011, Pages 31012-1-31012-4

  Sha, Chu Hsuan ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Cu substrates; Electronic packaging; Flip chip interconnect; Si chips; Silver joints; Solid state bonding

Indexed keywords

EID: 85025203593     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4004660     Document Type: Article

References (9)

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