CPW-to-stripline vertical via transitions for 60GHz LTCC SOP applications

Progress in Electromagnetics Research Letters

Volumn 2, Issue , 2008, Pages 37-44

  Lee, Y C ^a  

^a Mokpo Maritime University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

SYSTEM-ON-PACKAGE;

AIR CAVITY; CONVENTIONAL TRANSITIONS; EM SIMULATION TOOLS; RADIATION LOSS; RETURN LOSS; SHUNT CAPACITANCE; SYSTEM-ON-PACKAGE APPLICATIONS;

STRIP TELECOMMUNICATION LINES;

EID: 84991327482     PISSN: 19376480     EISSN: None     Source Type: Journal    
DOI: 10.2528/PIERL07122805     Document Type: Article

References (10)

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2. Lee, Y. C., W.-I. Chang, and C. S. Park, “Monolithic LTCC SiP transmitter for 60GHZ wireless communication terminals,” IEEE MTT-S Int. Microwave Symposium Digest, June 2005.
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5. Panther, A., C. Glaser, M. G. Stubbs, and J. S. Wight, “Vertical transitions in low temperature co-fired ceramics for LMDS applications,” IEEE MTT-S Int. Microwave Symposium Digest, Vol. 3, 1907-1910, 2001.
6. Lei, S., Y. X. Guo, and L. C. Ong, “CPW to stripline transitions in LTCC for millimeter-wave applications,” IEEE Asia Pacific Microwave Conference (APMC) Proceedings, 2005.
7. Schmuckle, F. J., A. Jentzch, W. Heinrich, J. Butz, and M. Spinnler, “LTCC as MCM substrate: design of strip-line structures and flip-chip interconnections,” IEEE MTT-S Int. Microwave Symposium Digest, Vol. 3, 1093-1096, 2001.
8. Yang, T.-H., C.-F. Chen, T.-Y. Huang, C.-L. Wang, and R.-B. Wu, “A 60 GHz LTCC transition between microstrip line and substrate integrated waveguide,” IEEE Asia Pacific Microwave Conference (APMC) Proceedings, 2005.
9. Heyen, J., A. Gordiyenko, P. Heide, and A. F. Jacob, “Vertical feedthroughs for millimeter-wave LTCC modules,” 33rd European Microwave Conference Proceedings, 411-414, 2003.
10. CST MICROWAVE STUDIO, CST Inc., [Online] Available: http://www.cst.com.