Distinct modes in the evolution of interaction between polymer film and atmospheric pressure plasma jet

Plasma Processes and Polymers

Volumn 14, Issue 7, 2017, Pages

  Wang, Tao ^a   Yang, Bin ^a   Chen, Xiang ^a   Wang, Xiaolin ^a   Yang, Chunsheng ^a   Liu, Jingquan ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

floating substrate; interaction mode; plasma jet; polymer treatments

Indexed keywords

ATMOSPHERIC PRESSURE; ELECTRIC DISCHARGES; ETCHING; PLASMA JETS; POLYMER FILMS; SEMICONDUCTING FILMS; SUBSTRATES;

ATMOSPHERIC PRESSURE PLASMA JETS; COPPER SUBSTRATES; FLOATING SUBSTRATE; INTERACTION MODES; INTERACTION PROCESS; PLASMA CHARACTERISTICS; POLYMER TREATMENT; SILICON SUBSTRATES;

FIGHTER AIRCRAFT;

EID: 84990207066     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.201600067     Document Type: Article

References (30)

1. K. Fricke, H. Steffen, T. Von Woedtke, K. Schröder, K. D. Weltmann, Plasma Processes and Polym. 2011, 8, 51.
2. H. Paetzelt, G. Böhm, T. Arnold, Plasma Sources Sci. Technol. 2015, 24, 025002.
3. A. J. Knoll, P. Luan, E. A. J. Bartis, C. Hart, Y. Raitses, G. S. Oehrlein, Appl. Phys. Lett. 2014, 105, 171601.
4. I. Onyshchenko, A. Yu Nikiforov, N. De Geyter, R. Morent, Plasma Processes and Polym. 2015, 12, 466.
5. P. Zhao, W. Zheng, J. Watanabe, Y. D. Meng, M. Nagatsu, Plasma Processes and Polym. 2015, 12, 431.
6. R. P. Gandhiraman, E. Singh, D. C. Diaz-Cartagena, D. Nordlund, J. Koehne, M. Meyyappan, Appl. Phys. Lett. 2016, 108, 123103.
7. S. Hofmann, K. van Gils, S. van der Linden, S. Iseni, P. Bruggeman, Eur. Phys. J. D 2014, 68, 1.
8. S. A. Norberg, E. Johnsen, M. J. Kushner, J. Appl. Phys. 2015, 118, 013301.
9. T. Ichiki, R. Taura, Y. Horiike, J. Appl. Phys. 2004, 95, 35.
10. M. Engelhardt, R. Pothiraja, K. Kartaschew, N. Bibinov, M. Havenith, P. Awakowicz, J. Phys. D: Appl. Phys. 2016, 49, 145201.
11. K. S. Seo, J. H. Cha, M. K. Han, C. S. Ha, D. H. Kim, H. J. Lee, H. J. Lee, Jpn. J. Appl. Phys. 2014, 54, 01AE06.
12. K. Fricke, H. Steffen, T. Von Woedtke, K. Schröder, K. D. Weltmann, Plasma Processes and Polym. 2011, 8, 51.
13. K. G. Kostov, T. M. C. Nishime, A. H. R. Castro, A. Toth, L. R. D. O. Hein, Appl. Surf. Sci. 2014, 314, 367.
14. D. Riès, G. Dilecce, E. Robert, P. F. Ambrico, S. Dozias, J. M. Pouvesle, J. Phys. D: Appl. Phys. 2014, 47, 275401.
15. S. Yonemori, R. Ono, J. Phys. D: Appl. Phys. 2014, 47, 125401.
16. R. Zaplotnik, M. Bišćan, Z. Kregar, U. Cvelbar, M. Mozetič, S. Milošević, Spectrochim. Acta B 2015, 103, 124.
17. B. J. Kim, E. Meng, J. Micromech. Microeng. 2015, 26, 013001.
18. Y. Shang, X. Ye, M. Wang, P. Song, J. Feng, J. Microelectromech. S. 2015, 24, 1132.
19. D. I. D. Cho, H. J. Yoo, J. Microelectromech. S. 2015, 24, 10.
20. B. J. Kim, E. Meng, Polym. Adv. Technol. 2015, 27, 564.
21. G. Borcia, C. A. Anderson, N. M. D. Brown, Plasma Sources Sci. Technol. 2003, 12, 335.
22. Z. Hao, S. Ji, A. Qiu, IEEE Trans. Plasma Sci. 2012, 40, 2822.
23. A. Bourdon, T. Darny, F. Pechereau, J. M. Pouvesle, P. Viegas, S. Iséni, E. Robert, Plasma Sources Sci. Technol. 2016, 25, 035002.
24. G. B. Sretenović, I. B. Krstić, V. V. Kovačević, B. M. Obradović, M. M. Kuraica, J. Phys. D: Appl. Phys. 2014, 47, 102001.
25. E. Robert, T. Darny, S. Dozias, S. Iseni, J. M. Pouvesle, Phys. Plasmas 2015, 22, 122007.
26. R. R. Callahan, G. B. Raupp, S. P. Beaudoin, J. Vac. Sci. Technol. B 2001, 19, 725.
27. H. Abe, M. Yoneda, N. Fujiwara, Jpn. J. Appl. Phys. 2008, 47, 1435.
28. T. Dufour, J. Hubert, N. Vandencasteele, P. Viville, R. Lazzaroni, F. Reniers, J. Phys. D: Appl. Phys. 2013, 46, 315203.
29. J. S. Oh, Y. Kakuta, Y. Yasuoka, H. Furuta, A. Hatta, Diam. Relat. Mater. 2014, 50, 91.
30. Ö. Birer, Appl. Surf. Sci. 2015, 354, 420.