Real time characterization of polymer surface modifications by an atmospheric-pressure plasma jet: Electrically coupled versus remote mode

Applied Physics Letters

Volumn 105, Issue 17, 2014, Pages

  Knoll, A J ^a   Luan, P ^a   Bartis, E A J ^a   Hart, C ^a   Raitses, Y ^b   Oehrlein, G S ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b PRINCETON PLASMA PHYSICS LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC CHEMISTRY; ATMOSPHERIC PRESSURE; ETCHING; PLASMA JETS;

ATMOSPHERIC PRESSURE PLASMA JETS; ATMOSPHERIC PRESSURE PLASMAS; ELECTRICAL INTERACTION; ENERGY DEPOSITIONS; POLYMER INTERACTIONS; POLYMER SURFACE MODIFICATION; REAL-TIME CHARACTERIZATIONS; SOURCE TEMPERATURE;

POLYMER FILMS;

EID: 84908439608     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4900551     Document Type: Article

References (20)

1. E. A. J. Bartis, D. B. Graves, J. Seog, and G. S. Oehrlein, J. Phys. D.: Appl. Phys. 46 (31), 312002 (2013). 10.1088/0022-3727/46/31/312002
2. J. Ehlbeck, U. Schnabel, M. Polak, J. Winter, T. von Woedtke, R. Brandenburg, T. von dem Hagen, and K. D. Weltmann, J. Phys. D: Appl. Phys. 44 (1). 013002 (2011). 10.1088/0022-3727/44/1/013002
3. X. Pei, X. Lu, J. Liu, D. Liu, Y. Yang, K. Ostrikov, P. K. Chu, and Y. Pan, J. Phys. D: Appl. Phys. 45 (16), 165205 (2012). 10.1088/0022-3727/45/16/165205
4. M. Laroussi and T. Akan, Plasma Processes Polym. 4 (9), 777 (2007). 10.1002/ppap.200700066
5. D. Pappas, J. Vac. Sci. Technol. A 29 (2), 020801 (2011). 10.1116/1.3559547
6. M. Y. Alkawareek, Q. T. Algwari, G. Laverty, S. P. Gorman, W. G. Graham, D. O'Connell, and B. F. Gilmore, Plos One 7 (8), e44289 (2012). 10.1371/journal.pone.0044289
7. C. Q. Wang and X. N. He, Surf. Coat. Technol. 201 (6), 3377 (2006). 10.1016/j.surfcoat.2006.07.205
8. A. Sarani, A. Y. Nikiforov, N. De Geyter, R. Morent, and C. Leys, Appl. Surf. Sci. 257 (20), 8737 (2011). 10.1016/j.apsusc.2011.05.071
9. M. J. Pavlovich, H.-W. Chang, Y. Sakiyama, D. S. Clark, and D. B. Graves, J. Phys. D: Appl. Phys. 46 (14), 145202 (2013). 10.1088/0022-3727/46/14/145202
10. K. Fricke, S. Reuter, D. Schroeder, V. Schulz-von der Gathen, K.-D. Weltmann, and T. von Woedtke, IEEE Trans. Plasma Sci. 40 (11), 2900 (2012). 10.1109/TPS.2012.2212463
11. M. Teschke, J. Kedzierski, E. G. Finantu-Dinu, D. Korzec, and J. Engemann, IEEE Trans. Plasma Sci. 33 (2), 310 (2005). 10.1109/TPS.2005.845377
12. T. C. Manley, Trans. Electrochem. Soc. 84, 83 (1943). 10.1149/1.3071556
13. L. A. Rosenthal and D. A. Davis, IEEE Trans. Ind. Appl. IA-11 (3), 328 (1975). 10.1109/TIA.1975.349324
14. X.-J. Shao, N. Jiang, G.-J. Zhang, and Z.-X. Cao, Appl. Phys. Lett. 101 (25), 253509 (2012). 10.1063/1.4772639
15. R. Brandenburg, Z. Navratil, J. Jansky, P. St'ahel, D. Trunec, and H. E. Wagner, J. Phys. D: Appl. Phys. 42 (8), 085208 (2009). 10.1088/0022-3727/42/8/085208
16. H. M. Katsch, C. Manthey, J. A. Wagner, and H. F. Dobele, Surf. Coat. Technol. 200 (1-4), 831 (2005). 10.1016/j.surfcoat.2005.01.023
17. G. Park, H. Lee, G. Kim, and J. K. Lee, Plasma Processes Polym. 5 (6), 569 (2008). 10.1002/ppap.200800019
18. Y. Sakiyama, D. B. Graves, J. Jarrige, and M. Laroussi, Appl. Phys. Lett. 96 (4), 041501 (2010). 10.1063/1.3298639
19. G. M. W. Kroesen, G. S. Oehrlein, and T. D. Bestwick, J. Appl. Phys. 69 (5), 3390 (1991). 10.1063/1.348517
20. A. Y. Nikiforov, A. Sarani, and C. Leys, Plasma Sources Sci. Technol. 20 (1), 015014 (2011). 10.1088/0963-0252/20/1/015014