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Volumn 28, Issue 1, 2017, Pages 808-817

Graphene nanoparticle dispersion in epoxy thin film composites for electronic applications: effect on tensile, electrical and thermal properties

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE COMPOUNDS; DISPERSIONS; FILLERS; GLASS TRANSITION; GRAPHENE; SOLVENTS; THERMODYNAMIC PROPERTIES; THIN FILMS;

EID: 84984799181     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-016-5594-y     Document Type: Article
Times cited : (21)

References (38)
  • 1
    • 84949179460 scopus 로고    scopus 로고
    • System integration by advanced electronics packaging
    • Gerlach G, Wolter K-J, (eds), Springer, Berlin Heidelberg
    • K. Wolter, System integration by advanced electronics packaging, in Bio and Nano Packaging Techniques for Electron Devices, ed. by G. Gerlach, K.-J. Wolter (Springer, Berlin Heidelberg, 2012), pp. 31–48
    • (2012) Bio and Nano Packaging Techniques for Electron Devices , pp. 31-48
    • Wolter, K.1
  • 2
    • 80855136869 scopus 로고    scopus 로고
    • Nano-conductive adhesives for nano-electronics interconnection
    • Wong CP, Moon KS, Li Y, (eds), Springer, US
    • Y. Li, K.S. Moon, C. Wong, Nano-conductive adhesives for nano-electronics interconnection, in Nano-Bio-Electronic, Photonic and MEMS Packaging, ed. by C.P. Wong, K.S. Moon, Y. Li (Springer, US, 2010), pp. 19–45
    • (2010) Nano-Bio-Electronic, Photonic and MEMS Packaging , pp. 19-45
    • Li, Y.1    Moon, K.S.2    Wong, C.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.