The future of RTP, a technology that can change the IC fab industry

9th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2001

Volumn , Issue , 2001, Pages 13-27

  Mattson, B ^a   Timans, P ^a   Tay, Sing Pin ^a   Devine, D J ^a   Kim, Jung ^a  

^a MATTSON THERMAL PRODUCTS GMBH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUDGET CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE;

BATCH FURNACES; CYCLE TIME; IN-PROCESS; SEMICONDUCTOR INDUSTRY; STATE OF THE ART; THERMAL BUDGET; THROUGHPUT PERFORMANCE;

HEAT TREATMENT;

EID: 84983123679     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RTP.2001.1013741     Document Type: Conference Paper

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