Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 6, Issue 3, 2016, Pages 486-496

  Kim, Sangkil ^a   Shamim, Atif ^b   Georgiadis, Apostolos ^c   Aubert, Herve ^d   Tentzeris, Manos M ^e  

^a QUALCOMM INC   (United States)

^b KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Saudi Arabia)

^c CENTRE TECNOLÒGIC DE TELECOMUNICACIONS DE CATALUNYA CTTC   (Spain)

^d CNRS   (France)

^e GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Additive fabrication; inkjet printed substrate integrated waveguide (SIW); inkjet printed via; low cost via fabrication; polymethyl methacrylate (PMMA).

Indexed keywords

EQUIVALENT CIRCUITS; FABRICATION; POLYMETHYL METHACRYLATES; SILVER NANOPARTICLES; SUBSTRATES;

ADDITIVE FABRICATION; EQUIVALENT CIRCUIT MODEL; INK-JET PRINTING TECHNOLOGIES; INKJET-PRINTED VIA; MICROWAVE FREQUENCY RANGES; POLYMER SUBSTRATE; PRINTED SUBSTRATE; VIA FABRICATION;

SUBSTRATE INTEGRATED WAVEGUIDES;

EID: 84976240522     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2016.2522461     Document Type: Article

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