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Proceedings of the IEEE Conference on Nanotechnology

Volumn , Issue , 2011, Pages 473-477

Nano-silver inkjet printed interconnections through the microvias for flexible electronics

(4) Falat, Tomasz a Felba, Jan a Moscicki, Andrzej b Borecki, Janusz c

a WROCLAW UNIVERSITY OF TECHNOLOGY (Poland)

b Amepox Microelectronics (Poland)

c Tele and Radio Research Institute (Poland)

Author keywords

flexible electronics; inkjet printing; microvias; Nanosilver

Indexed keywords

COMPUTER DISPLAY; ELECTRICALLY CONDUCTIVE; ELECTRONIC COMPONENT; ELECTRONIC INDUSTRIES; FLEXIBLE SUBSTRATE; MICROVIAS; NANOSILVER; RADIO FREQUENCY IDENTIFICATION TAGS; ROLL-TO-ROLL PROCESSING; SENSORS AND ACTUATORS; THROUGH HOLE; VERTICAL INTERCONNECTIONS;

DISPLAY DEVICES; FLEXIBLE MANUFACTURING SYSTEMS; INK JET PRINTING; MINIATURE INSTRUMENTS; NANOTECHNOLOGY; PRINTED CIRCUIT BOARDS; RADIO FREQUENCY IDENTIFICATION (RFID); SUBSTRATES;

FLEXIBLE ELECTRONICS;

EID: 84858971207 PISSN: 19449399 EISSN: 19449380 Source Type: Conference Proceeding
DOI: 10.1109/NANO.2011.6144291 Document Type: Conference Paper

Times cited : (25)

References (5)

1
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- Materials and technology for conductive microstractures
- H. Ed. James E. Morris, Springer New York
- Felba J. and H. Schaefer H., "Materials and technology for conductive microstractures" in: "Nanopackaging: nanotechnologies and electronics packaging". Ed. James E. Morris, Springer (New York, 2008)
- (2008) Nanopackaging: Nanotechnologies and Electronics Packaging
- Felba, J.¹ Schaefer, H.²

2
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- Conductive microstractures and connections for microelectronics made by ink-jet technology
- Dresden
- Moscicki A., Felba J. and Dudzinski W., "Conductive Microstractures and Connections for Microelectronics Made by Ink-Jet Technology", Proc. of 1st Electronics Systemintegration Technology Conference, ESTC2006, Dresden 2006, p.511-517
- (2006) Proc. of 1st Electronics Systemintegration Technology Conference, ESTC 2006 , pp. 511-517
- Moscicki, A.¹ Felba, J.² Dudzinski, W.³

3
- 33847232915
- Electrically conductive formulations filled nano size silver filler for ink-jet technology
- Wroclaw
- Moscicki A., Felba J., Sobierajski T., Kudzia J., Arp A. and Meyer W., "Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology", Proc. of 5th International IEEE Conference on Polymers and Adhesive in Microelectronic and Photonics, Polytronic2005, Wroclaw 2005, p.40-44
- (2005) Proc. of 5th International IEEE Conference on Polymers and Adhesive in Microelectronic and Photonics, Polytronic 2005 , pp. 40-44
- Moscicki, A.¹ Felba, J.² Sobierajski, T.³ Kudzia, J.⁴ Arp, A.⁵ Meyer, W.⁶

4
- 0004115596
- McGraw-Hill, New York
- J. H. Lau, S. W. R. Lee, "Microvias for Low Cost, High Density Interconnect", McGraw-Hill, New York, 2001
- (2001) Microvias for Low Cost, High Density Interconnect
- Lau, J.H.¹ Lee, S.W.R.²

5
- 77950928877
- Properties of conductive microstractures containing nano sized silver particles
- Singapore
- Felba, J. et al, "Properties of Conductive Microstractures Containing Nano Sized Silver Particles", Proc. of 11th Electronics Packaging Technology Conference, EPTC2009, Singapore, 2009, p.879-883
- (2009) Proc. of 11th Electronics Packaging Technology Conference, EPTC 2009 , pp. 879-883
- Felba, J.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.