SCOPUS 정보 검색 플랫폼

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

Volumn , Issue , 2011, Pages

Inkjet printing of electrical vias

(6) Reinhold, Ingo a,b Thielen, Moritz a Voit, Wolfgang a,b Zapka, Werner a,b Götzen, Reiner c Bohlmann, Helge c

a XaarJet AB (Sweden)

b ROYAL INSTITUTE OF TECHNOLOGY (Sweden)

c MicroTEC Gesellschaft für Mikrotechnologie MbH ^* (Germany)

Author keywords

electrical via; inkjet printing; silver nano particle ink

Indexed keywords

CONVECTION OVEN; ELECTRICAL CONNECTION; ELECTRICAL INTERCONNECTIONS; ELECTRICAL VIA; GREEN LIGHT; HIGH THROUGHPUT; INKJET PRINTHEADS; PROOF OF PRINCIPLES; ROLL TO ROLL; ROLL TO ROLL MANUFACTURING; SELF ALIGNMENT; SILVER-NANOPARTICLES; THROUGH HOLE; VERTICAL WALL; VIA HOLE;

ELECTRIC CONNECTORS; INK JET PRINTING; LIGHT EMITTING DIODES; MICROELECTRONICS; NANOPARTICLES; SINTERING;

INK;

EID: 84857532121 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (10)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.