Evaluation of inkjet technology for electronic packaging and system integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 89-94

  Mäntysalo, Matti ^a   Mansikkamäki, Pauliina ^a   Miettinen, Jani ^a   Kaija, Kimmo ^a   Pienimaa, Seppo ^b   Rönkkä, Risto ^b   Hashizume, Kenichi ^b   Kamigori, Akiko ^b   Matsuba, Yorishige ^c   Oyama, Kenshu ^c   Terada, Nobuto ^c   Saito, Hiroshi ^c   Kuchiki, Mikiharu ^c   Tsubouchi, Mikihiko ^c  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

^c Harima Chemicals ^*

Author keywords

[No Author keywords available]

Indexed keywords

INKJET TECHNOLOGY; NON-CONTACTING DEPOSITION METHOD; PRINTABLE ELECTRONICS;

ELECTRODEPOSITION; FLEXIBLE MANUFACTURING SYSTEMS; INTEGRATION; PRINTING; SURFACE TREATMENT;

ELECTRONICS PACKAGING;

INK JET PRINTING; SURFACE TREATMENT;

EID: 35348887752     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373781     Document Type: Conference Paper

References (11)

1. th EMPC.
2. th Electronic and Components Technology Conference. Lake Buena Vista, Florida, USA.
3. Radivojevic, Z., Andersson, K., Hasizume, K., Heino, M., Mäntysalo, M., Mansikkamäki, P., Matsuba, Y., Terada, N. 2006. "Optimized Curing of Solver Inkjet Based Printed Traces" THERMINIC 2006. Nice, France. Sept. 27-29. pp. 163-168
4. th International Symposium on Microelectronics, Oct. 8-12, 2006, San Diego, pp. 484-490.
5. th International Symposium on Microelectronics, Oct. 8-12, 2006, San Diego, pp. 462-69.
6. th International Symposium on Microelectronics, Oct. 8-12, 2006, San Diego.
7. th International Conference on Electronic Packaging Technology, China, Aug. 30-Sept. 2, 2005.
8. Lee, K. J., Jun, B. H., Kim, T. H., Joung, J. 2006 "Direct Synthesis and Inkjetting of Silver Nanocrystals Toward Printed Electronics" Nanotechnology, number 17, April 2006
9. Wu, Y., Lui, P., Li, Y., Ong, B. S. 2006 "Enabling materials for printed electronics" IEEE Lasers & ElectroOptics Society. Oct. 2006. pp.434-435.
10. Down D. Redinger, et al, "An Ink-Jet-Deposited Passive Component Process for RFID", in IEEE Trans on Electronic Devices, Vol. 51, No. 12, Dec. 2004, pp. 1978-1983.
11. Seung, H., K., et al, "Fabrication of Multilayer Passive and active components on Polymer Using inkjet printing and low temperature laser Processing", in ELSEVIER Science Direct, article in press available on line.