Fabrication of silicon-silicide-on-insulator substrates using wafer bonding and layer-cutting techniques

2001 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2001 - Proceedings

Volumn 1, Issue , 2001, Pages 673-675

  Zhu, Shiyang ^a   Ru, Guoping ^a   Huang, Yiping ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

layer cutting; silicide; SOI; SSOI; wafer bonding

Indexed keywords

EID: 84966546555     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSICT.2001.981568     Document Type: Conference Paper

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