Selective growth of carbon nanotubes on silicon from electrodeposited nickel catalyst

Science of Advanced Materials

Volumn 1, Issue 1, 2009, Pages 86-92

  Romo Negreira, Ainhoa ^a,b   Richard, Olivier ^a   De Gendt, Stefan ^a,b   Maex, Karen ^b   Heyns, Marc M ^a,b   Vereecken, Philippe M ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Electrodeposition; Nanoparticles; Nanotubes; Nickel; Selectivity

Indexed keywords

EID: 84966501465     PISSN: 19472935     EISSN: 19472943     Source Type: Journal    
DOI: 10.1166/sam.2009.1012     Document Type: Article

References (28)

1. S. Iijima, Nature 354, 56 (1991).
2. V.N. Popov, Mat. Sci. Eng. R43, 61 (2004).
3. P.G. Collins and P. Avouris, Sci. Am. 283, 62 (2000).
4. F. Kreupl, A.P. Graham, G. Duesberg, M. Liebau, and E. Unger, Microelect. Eng. 64, 399 (1998).
5. W. Hoenlein, Jpn. J. Appl. Phys. 41, 4370 (2002).
6. N. Srivastava, R.V. Joshi, and K. Banerjee, IEEE International Electron Devices Meeting (IEDM) 257-260 (2005).
7. A. Romo-Negreira, D.J. Cott, A.S. Verhulst, S. Esconjauregui, N. Chiodarelli, J. Ek-Weis, C.M. Whelan, G. Groeseneken, M.M. Heyns, S. De Gendt, and P.M. Vereecken, MRS Spring Proceedings 1079, N06-01 (2008).
8. G. Zhang, D. Mann, L. Zhang, A. Javey, Y. Li, E. Yenilmez, Q. Wang, J.P. McVittie, Y. Nishi, J. Gibbons, and H. Dai, PNAS 102, 16141 (2005).
9. C.L. Cheung, A. Kurtz, H. Park, and C.M. Lieber, J. Phys. Chem. B 106, 2429 (2002).
10. M. Hu, Y. Murakami, M. Ogura, S. Maruyama, and T. Okubo, J. Catal. 225, 230 (2004).
11. M. Nihei, T. Yakushima, S. Sato, T. Nozue, M. Norimatsu, M. Mishima, T. Murakami, D. Kondo, A. Kawabata, M. Ohfuti, and Y. Awano, IEEE Intl. Interconnect. Tech. Conf. 204-206 (2007).
12. E.F. Kukovitsky, S.G.L 'vov, N.A. Sainov, V.A. Shustov, and L.A. Chernozatonskii, Chem. Phys. Lett. 355, 497 (2002).
13. C.L. Cheung, A. Kurtz, H. Park, and C.M. Lieber, J. Phys. Chem. B 106, 2429 (2002).
14. Y. Zhang, Y. Li, W. Kim, D. Wang, and H. Dai, Appl. Phys. A 74, 325 (2002).
15. G. Oskam, J.G. Long, A. Natarajan, P.C. Searson, J. Phys. D: Appl. Phys. 31, 1927 (1997).
16. Y. Tu, Z.P. Huang, D.Z. Wang, J.G. Wen, and Z.F. Ren, Appl. Phys. Lett. 80, 4018 (2002).
17. D. Liu, J. Chen, W. Deng, H. Zhou, and Y. Kuang. Mat. Lett. 58, 2764 (2004).
18. M. Tamura, Y. Kemmochi, Y. Murakami, N. Chino, M. Ogura, S.P. Naik, M. Takai, Y. Tsuji, S. Maruyama, and T. Okubo. Appl. Phys. A 84, 247 (2006).
19. P.C Andricacos, F. Uzoh, J.O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Dev. 42, 567 (1998).
20. A. Romo-Negreira, P.M. Vereecken, C.M. Whelan, G. Groeseneken, and K. Maex, ECS Transactions 2, 409 (2007).
21. M.P. Zach and R.M. Penner, Adv. Mater. 12, 878 (2000).
22. W. Davison and J.A. Harrison, J. Electroanal. Chem. 36, 399 (1972).
23. G.O'Mallory, Electroless Plating: Fundamentals and Applications, edited by G.O'Mallory and J.B. Hajdu, American Society of Civil Engineers, Reston (1990).
24. http://rsbweb.nih.gov/ij/.
25. A.J. Bard and L.R. Faulkner, Electrochemical Methods, Fundamentals and Application, edited by D. Harris, 2nd edn., John Wiley and sons, New York, NY (2000), p.163.
26. S. Esconjauregui, C.M. Whelan, and K. Maex, Nanotechnology 18, 1 (2007).
27. S. Mehdizadeh, J.O. Dukovic, P.C. Andricacos, L.T. Romankiw, and H.Y. Cheh, J. Electrochem. Soc. 139, 78 (1992).
28. K. Stulik, C. Amatore, K. Holub, V. Marecek, and W. Kutner, Pure Appl. Chem. 72, 1483 (2000).