Constriction resistance model in thermal analysis of solder ball joints in ball grid array packages

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 364-1, Issue , 1999, Pages 29-36

  Ying, T M ^a   Toh, K C ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT LOSSES; HEAT RESISTANCE; MATHEMATICAL MODELS; SOLDERED JOINTS; THERMODYNAMICS;

BALL GRID ARRAY PACKAGE; TEMPERATURE DROP; THERMAL BOUNDARY CONDITION;

THERMOANALYSIS;

EID: 0033347764     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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