Pattern effects and how to explore them

10th IEEE International Conference on Advanced Thermal Processing of Semiconductors, RTP 2002

Volumn , Issue , 2002, Pages 49-57

  Niess, J ^a   Berger, R ^b   Timans, P J ^a   Nenyei Z ^a  

^a MATTSON THERMAL PRODUCTS GMBH   (United States)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT CONDUCTION; HEAT RESISTANCE; HEAT TREATMENT;

DEFECT GENERATION; HEAT CONDUCTION EQUATIONS; INDUCED TEMPERATURE; NON-UNIFORMITIES; PATTERN STRUCTURE; PROCESS UNIFORMITY; SEMI-EMPIRICAL CALCULATION; TEMPERATURE PROFILES;

ION IMPLANTATION;

EID: 84962427821     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RTP.2002.1039439     Document Type: Conference Paper

References (16)

1. R. Berger, S. Miethaner, H. Gruber, J. Niess, W. Dietl, Z. Nényei: Pattern Shift Reduction in Dual Side Heated RTP Systems with Hot Shielding Technology. RTP'01 Conference Proc., Anchorage Ak (2001), 71-77
2. L.H. Nguyen, W. Dietl, J. Niess, Z. Nényei, S.P. Tay, G. Obermeier, D.F. Downey: Logic in RTP, RTP'99 Conference Proc., Colorado Springs, CO (1999), 26-38
3. Z. Nényei, J. Niess, S. Buschbaum, K. Meyer, W. Dietl, R. Berger, S. Miethaner, H. Gruber, R. Wahlich, S. Chamberlain: Pattern Effects in RTP: Still a Hidden World in Production? Rapid Thermal and Other Short-Time Processing Technologies III, Electrochemical Society Proceedings 2002, to be printed.
4. R. Kakoschke, Temperature Problems with Rapid Thermal Processing for VLSI Applications, Nucl. Instr. and Methods in Phys. Res. B 37/38 (1989) 753-759
5. R. Kakoschke, E. Bussmann and H. Föll, Modelling of Wafer Heating During Rapid Thermal Processing, Appl. Phys. A 50. (1990) 141-150
6. R. Kakoschke, Is there a Way to a Perfect Rapid Thermal Processing System? Mat. Res. Soc. Proc. Vol. 224 (1991) 159-170
7. P. Vandenabeele and K. Maex, Temperature Nonuniformities During Rapid Thermal Processing of Patterned Wafers, Rapid Isothermal Processing, Rajendra Singh, Editor, Proc. SPIE 1189 (1989) 89
8. P. Vandenabeele and K. Maex, Round Robin Comparison of Temperature Non-Uniformity During RTP Due to Patterned Layers, Rapid Thermal and Related Processing Technique, R. Singh, M. M. Moslehi, Editors, Proc. SPIE 1393 (1990) 372
9. P. Vandenabeele and K. Maex, Temperature Control and Temperature Uniformity During Rapid Thermal Processing, Rapid Thermal and Integrated Processing, J. C. Gelpey, M. L. Green, R. Singh, J, J, Wortman, Editors, Proc. MRS 224 (1991) 185
10. W. Eichhammer, P. Vandenabeele and K. Maex, Temperature Control and Uniformity During Rapid Thermal Silicidation, Rapid Thermal and Integrated Processing, J. C. Gelpey, M. L. Green, R. Singh, J. J. Wortman, Editors, Proc. MRS 224 (1991) 487
11. P.J. Timans, Z. Nényei, R. Berger, Device Scaling Drives Pattern Effect Solutions, Solid State Technology 5 (2002) 67-72
12. C. Davis, M. Moslehi, A. Bowling and J. Luttmer, Microelectronics Manufacturing Science and Technology: Equipment and Sensor Technologies, TI-Technical Journal, Sept-Oct 1992. 20-41 (Texas Instruments)
13. P. Stancavage, Minimizing Pattern Effects Resulting From Rapid Thermal Processing, Micro-Magazine 7/8 (2002) 71-76
14. E.H.A. Granneman, C. Laviron, A. Halimaoui, R. El Farhane, V.I. Kuznetsov, X. Pages, R. Grisel, H. Terhorst, Emissivity Dependence of Spike Anneal Levitor and Lamp-Based Heating Systems, Rapid Thermal and Other Short-Time Processing Technologies III, Electrochemical Society Proceedings 2002, to be printed.
15. G. Bentini, L. Correra, C. Donolato, Defects Introduced in Silicon Wafers During Rapid Isothermal Annealing: Thermoelastic and Thermoplastic Effects, J. Appl. Phys. 56 (10), (1984) 2922-2929
16. V. E. Borisenko, P. J, Hesketh, Rapid Thermal Processing of Semiconductors, Plenum Press, New York (1997)