Pattern shift reduction in dual side heated RTP systems with hot shielding technology

9th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2001

Volumn , Issue , 2001, Pages 71-77

  Berger, R ^a   Miethaner, S ^a   Gruber, H ^a   Niess, J ^b   Dietl, W ^b   Nenyei Z ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b MATTSON THERMAL PRODUCTS GMBH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BICMOS TECHNOLOGY; HEAT TREATMENT; PLATES (STRUCTURAL COMPONENTS); RAPID THERMAL PROCESSING; SILICON WAFERS;

BI-CMOS PROCESS; CONTACT LITHOGRAPHY; NON-UNIFORMITIES; PROCESS IMPROVEMENT; RADIATIVE ENERGY; RADIATIVE ENERGY FLUX; SLIP-LINE GENERATION; THERMALLY STABLE;

SHIELDING;

EID: 84983168189     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RTP.2001.1013746     Document Type: Conference Paper

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