Evaluation of thermal shear strains in flip-chip package by electronic speckle pattern interferometry (ESPI)

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 310-314

  Jang, Woosoon ^a   Lee, Baik Woo ^a   Kim, Dong Won ^a   Nah, Jae Woong ^b   Paik, Kyung Wook ^b   Kwon, Dongil ^a  

^a Seoul National University   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DEFORMATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFEROMETRY; LEAD; MERGERS AND ACQUISITIONS; MODIFIED ATMOSPHERE PACKAGING; PRINTED CIRCUITS; SHEAR STRAIN; SOLDERED JOINTS; SPECKLE; STRAIN; THERMAL EXPANSION; TIN;

DISPLACEMENT RESOLUTION; ELECTRONIC SPECKLE PATTERN INTERFEROMETRY; FLIP CHIP SOLDER JOINTS; LOCAL DEFORMATIONS; PRINTED CIRCUIT BOARDS (PCB); TEMPERATURE CHANGES; THERMAL DEFORMATION; THERMAL VACUUM CHAMBERS;

PRINTED CIRCUIT BOARDS;

EID: 84960389920     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.984002     Document Type: Conference Paper

References (8)

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