Thermoelectric and thermionic micro-converters

ESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference

Volumn 2006-January, Issue , 2006, Pages 431-434

  Gerstenmaier, Y C ^a   Wachutka, G ^b  

^a SIEMENS AG   (Germany)

^b TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EFFICIENCY; ELECTRODES; OHMIC CONTACTS; SOLID STATE DEVICES;

COOLING APPLICATIONS; ELECTRODE MATERIAL; HIGH OPERATING TEMPERATURE; LOW TEMPERATURES; NANOMETER DESIGN; OHMIC RESISTANCE; THERMIONIC CONVERTERS; THERMOELECTRIC DEVICES;

THERMIONIC POWER GENERATION;

EID: 84957890822     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/essder.2006.307730     Document Type: Conference Paper

References (18)

1. G.S. Nolas, J. Sharp, H.J. Goldsmid, Thermoelectrics, Basic Principles and New Materials Developments, Berlin 2001.
2. M.S. El-Genk, H.H. Saber, J. Sakomoto, T. Caillat, Proc. of Intern. Conf. on Thermoelectrics 2003 (ICT2003), pp.417-420.
3. A. Shakouri, Y. Zhang, "On-Chip Solid-State Cooling for Integrated Circuits Using Thin-Film Microrefrigerators," IEEE Trans. on Comp. and Pack. Technol., vol.28, 2005, pp.65-69.
4. J.W. Vandersande, J.-P. Fleurial, "Thermal management of power electronics using thermoelectric coolers," Proc. of Intern. Conf. on Thermoelectrics 1996 (ICT1996), pp. 252-255.
5. M. Strasser, R. Aigner, M. Franosch, G. Wachutka, "Miniaturized thermoelectric generators based on poly-Si and poly-SiGe surface micromachining," Sensors and Actuators A, A97-98, 2002, pp. 535-542.
6. X. Fan et al., "SiGeC/Si superlattice microcoolers," Applied Physics Letters, vol.78(11), 2001, pp.1580-1582.
7. R. Venkatasubramanian, E. Siivola, T. Colpitts, B. O'Quinn, "Thin-film thermoelectric devices with high room-temperature figures of merit," Nature, vol. 413, Oct. 2001, pp. 597-602.
8. S. Ghamaty, J.C. Bass, N.B. Elsner, "Quantum well thermoelectric devices and applications," Proc of Intern. Conf. on Thermoelectrics 2003 (ICT2003), pp. 563-566.
9. S.W. Angrist, "Direct Energy Conversion," 3rd edition, Allyn and Bacon, Boston, 1977.
10. G.D. Mahan, "Thermionic refrigeration," J. Appl. Phys. 76, 1994, pp. 4362-4366.
11. G.D. Mahan, J.O. Sofo, M. Bartkowiak, "Multilayer thermionic refrigerator and generator," J. Appl. Phys. 83, 1998, pp.4683-4689.
12. Y. Hishinuma, T.H. Geballe, B.Y. Moyzhes, "Refrigeration by combined tunneling and thermionic emission in vacuum: Use of nanometer scale design," Applied Phys. Letters, vol.78(17), 2001, pp.2572-2574.
13. th THERMINIC 2005, Belgirate, Italy, Sept. 2005, pp. 372-379.
14. A. Shakouri, J.E. Bowers, "Heterostructure integrated thermionic coolers," Applied Physics Letters, vol.71(9), 1997, pp.1234-1236.
15. A. Shakouri et al., "Thermionic emission cooling in single barrier heterostructures," Applied Physics Letters, vol.74(1), 1999, pp.88-89.
16. A. Shakouri, E.Y. Lee, D.L. Smith, V. Narayanamurti, J.E. Bowers, "Thermoelectric Effects in Submicron Heterostructure Barriers," Microscale Thermophysical Engineering, vol.2, 1998, pp.37-47.
17. A. Tavkhelidze et al., "Electron tunneling through large area vacuum gap - preliminary results, Proc. of Intern. Conf. on Thermoelectrics 2002 (ICT2002), pp. 435-439.
18. T.S. Fisher, D.G. Walker, "Thermal and Electrical Energy Transport and Conversion in Nanoscale Electron Field Emission Process," Journal of Heat Transfer, vol.124, 2002, pp. 954-962.