-
1
-
-
0034454864
-
A high reliability metal insulator metal capacitor for 0.18um copper technology
-
M. Armacost, et al, "A High Reliability Metal Insulator Metal Capacitor for 0.18um Copper Technology", Electron Devices Meeting, IEDM Technical Digest, 2000, pp 157-160.
-
(2000)
Electron Devices Meeting, IEDM Technical Digest
, pp. 157-160
-
-
Armacost, M.1
-
2
-
-
0345815430
-
Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and bi-CMOS technologies
-
P. Zurcher, et al, "Integration of Thin Film MIM Capacitors and Resistors into Copper Metallization based RF-CMOS and Bi-CMOS Technologies", Electron Devices Meeting, IEDM Technical Digest, 2000, pp. 153-156.
-
(2000)
Electron Devices Meeting, IEDM Technical Digest
, pp. 153-156
-
-
Zurcher, P.1
-
4
-
-
0034796390
-
A high performance 100 nm generation SOC technology (CMOS IV) for high density embedded memory and mixed signal LSIs
-
K. Miyashita, et al, "A High Performance 100 nm Generation SOC Technology (CMOS IV) for High Density Embedded Memory and Mixed Signal LSIs", Symposium on VLSI Technology, Digest of Technical Papers, 2001, pp. 11-12.
-
(2001)
Symposium on VLSI Technology, Digest of Technical Papers
, pp. 11-12
-
-
Miyashita, K.1
-
5
-
-
0036923873
-
High-capacitance Cu/Ta205/Cu M1M structure for SoC applications featuring a single-mask addon process
-
T. Ishikawa, et al, "High-Capacitance Cu/Ta205/Cu M1M Structure for SoC Applications Featuring a Single-Mask Addon Process", Electron Devices Meeting, IEDM Technical Digest, 2002, pp. 940-942.
-
(2002)
Electron Devices Meeting, IEDM Technical Digest
, pp. 940-942
-
-
Ishikawa, T.1
-
7
-
-
84983820607
-
Influence of interfacial tunnel exchange on dielectric losses in thin amorphous insulating films
-
C. Cherki, R. Coelho and R. Nannoni, "Influence of Interfacial Tunnel Exchange on Dielectric Losses in Thin Amorphous Insulating Films", Phys. Stat. Sol. (a) 2, 785 (1970).
-
(1970)
Phys. Stat. Sol. (a)
, vol.2
, pp. 785
-
-
Cherki, C.1
Coelho, R.2
Nannoni, R.3
-
8
-
-
0015342452
-
A dielectric loss model based on interfacial electron tunneling
-
P. Wilcox, "A Dielectric Loss Model based on Interfacial Electron Tunneling", Canadian J. Phys. 50, 912 (1972).
-
(1972)
Canadian J. Phys.
, vol.50
, pp. 912
-
-
Wilcox, P.1
-
9
-
-
0000146687
-
Surface roughness effect on capacitance and leakage current of an insulating film
-
Y.-P. Zhao et al., "Surface Roughness Effect on Capacitance and Leakage Current of an Insulating Film", Phys. Rev. B 60, 9157(1999).
-
(1999)
Phys. Rev. B
, vol.60
, pp. 9157
-
-
Zhao, Y.-P.1
-
10
-
-
33645441340
-
Thermal and dielectric breakdown for metal insulator metal capacitors (MIMCAP) with tantalum pentoxide dielectric
-
Lake Tahoe, CA
-
K.-H. Allers, et al., "Thermal and Dielectric Breakdown for Metal Insulator Metal Capacitors (MIMCAP) with Tantalum Pentoxide Dielectric", Presented at Integrated Reliability Workshop, Lake Tahoe, CA, 2002.
-
(2002)
Integrated Reliability Workshop
-
-
Allers, K.-H.1
-
11
-
-
0032691225
-
A TDDD model of si3n4 - Based capacitors in GaAs MMICs
-
J. Scarpulla, et al., "A TDDD Model of Si3N4 - based Capacitors in GaAs MMICs", Proc. of IEEE Int. Rel. Phys. Symp, 1999, pp. 128-137.
-
(1999)
Proc. of IEEE Int. Rel. Phys. Symp
, pp. 128-137
-
-
Scarpulla, J.1
-
12
-
-
0035554817
-
Reliability of metal insulator metal capacitors (MIMCAP)
-
Montreal
-
K.-H. Allers, et al., "Reliability of Metal Insulator Metal Capacitors (MIMCAP)", Presented at Advanced Metallization Conference, Montreal, 2001.
-
(2001)
Advanced Metallization Conference
-
-
Allers, K.-H.1
|