Cleans for Al vias in a 0.175 μm Dual Damascene Process

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 206-208

  Gambino, J ^a   Clevenger, L ^a   Costrini, G ^a   Schnabel, F ^a   Ravikumar, R ^a   Dobuzinsky, D ^a   Iggulden, R ^a   Dziobkowski, C ^a   Wildman, H ^a   Benedict, J ^a   Bruley, J ^a   Domenicucci, A ^a  

^a IBM RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; FLUORINE COMPOUNDS; INTEGRATED CIRCUIT INTERCONNECTS; LANDING; THERMODYNAMIC STABILITY;

AL OXIDE; DAMASCENE INTERCONNECTS; DUAL DAMASCENE PROCESS; DUAL DAMASCENE STRUCTURES; HIGH ASPECT RATIO; HIGH THERMAL STABILITY; LOW ASPECT RATIO; VIA RESISTANCE;

ALUMINUM;

EID: 84954435760     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787123     Document Type: Conference Paper

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