High frequency electrical characterization of a high wiring density organic substrate `ALIVHTM' and a stud bump bonding `SBBTM'

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 341-346

  Iwaki, H ^a   Taguchi, Y ^a   Shiraishi, T ^a   Bessho, Y ^a   Eda, K ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC LINES; EQUIVALENT CIRCUITS; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS; PERMITTIVITY; SUBSTRATES;

STUD BUMP BONDING (SBB);

FLIP CHIP DEVICES;

EID: 0032320973     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)