High frequency interconnections using electrically conductive adhesives

12th International Conference on Microwaves and Radar, MIKON 1998

Volumn 3, Issue , 1998, Pages 680-683

  Dernevik, M ^a   Liu, J ^b   Starski, P ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b IVF   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; RADAR;

ELECTRICAL MODELING; ELECTRICAL PERFORMANCE; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH FREQUENCY INTERCONNECTIONS; ISOTROPICALLY CONDUCTIVE ADHESIVE JOINT; PHYSICAL PARAMETERS; SOLDER JOINTS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 0013305290     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MIKON.1998.742803     Document Type: Conference Paper

References (5)

1. M. Dernevik, R. Sihlbom, Z. Lai, P. Starski, and J. Liu, "High frequency measurements and modelling of anisotropic electrically conductive adhesive flip-chip joint," presented at The Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, Kohala Coast, Hawaii, 1997.
2. M. Dernevik, R. Sihlbom, P. Starski, and J. Liu, "High-frequency properties of electrically conducting adhesive connections," presented at GigaHertz'97, Stockholm, Sweden, 1997.
3. R. Sihlbom, M. Dernevik, Z. Lai, P. Starski, and J. Liu, "Conductive Adhesives for High-Frequency Applications," presented at Polymeric Electronics Packaging, Norrkoping, Sweden, 1997.
4. R. Sihlbom and J. Liu, "High Frequency Signal Simulation of Anisotropically Conductive Adhesive Flip-Chip Joints," presented at Latest Achievements in Conductive Adhesive Joining in Electronics Packaging, Eindhoven, Netherlands, 1995.
5. Z. Lai and J. Liu, "Anisotropically Conductive Adhesive Flip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates," IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, vol. 19, pp. 644-660, 1996.