Overview of multilayered thin film theories for MEMS and electronic packaging applications

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 1058-1065

  Peng, Chih Tang ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Electronic packaging thermal management; Electronics packaging; Finite element methods; Microelectromechanical systems; Micromechanical devices; Nonhomogeneous media; Silicon; Thermal stresses; Transistors; Workability

Indexed keywords

ELECTROMECHANICAL DEVICES; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FILM PREPARATION; FORECASTING; MEMS; MICROELECTROMECHANICAL DEVICES; MULTILAYERS; SILICON; STRESSES; THERMAL STRESS; TRANSISTORS;

ELECTRONIC PACKAGING APPLICATIONS; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); MICROMECHANICAL DEVICE; MULTILAYER STRUCTURES; MULTILAYERED THIN FILMS; NONHOMOGENEOUS MEDIA; WORKABILITY;

FINITE ELEMENT METHOD;

EID: 84950157512     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012575     Document Type: Conference Paper

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