An analysis of an engineering model for the thermal mismatch stresses at the interface of a uniformly heated two layer structure

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 3, 1996, Pages 323-329

  Matthys, Lieven ^a   De Mey, Gilbert ^a,b  

^a GHENT UNIVERSITY   (Belgium)

^b University of Ghent ^*

Author keywords

Bimetal Thermostat Model; Finite Element Simulation; Peel Stress; Shear Stress; Stress Distribution

Indexed keywords

APPROXIMATION THEORY; ELECTRIC NETWORK ANALYSIS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MICROELECTRONIC PROCESSING; NETWORKS (CIRCUITS); NUMERICAL ANALYSIS; SHEAR STRESS; STRESS CONCENTRATION; THERMAL STRESS;

ENGINEERING MODEL; POLARITY ERRORS; THERMAL MISMATCH STRESSES; TIMOSHENKO BIMETAL THERMOSTAT MODEL; UNIFORMLY HEATED TWO LAYER STRUCTURE;

MATHEMATICAL MODELS;

EID: 0030246587     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (23)

1. Dai-heng Chen and Hironobu Nisitani, "Singular Stress Field Near the Corner of Jointed Dissimilar Materials," ASME Journal of Applied Mathematics, Vol. 60, pp. 607-613, September 1993.
2. W.T. Chen and C.W. Nelson, "Thermal Stress in Bonded Joints," IBM Journal of Research and Development, Vol. 23, No. 2, pp. 179-188, March 1979.
3. H.D. Conway, P. Borgesen, and C.-Y. Li, "Elastic Analysis of Flip-chip Solder Joints Undergoing Thermal Excursions," Journal of Electronic Packaging, Vol. 116, pp. 110-115, June 1994.
4. D.J. Dean, Thermal Design of Electronic Circuit Boards and Packages, Electrochemical Publications Ltd., 8 Barns Street, Ayr, Scotland, 1985.
5. D.J. Delia, T.C. Gilgert, N.H. Graham, U. Hwang, P.W. Ing, J.C. Kan, R.G. Kemink, G.C. Martin, K.P. Moran, J.R. Reyes, R.R. Schmidt, and R.A. Steinbrecher, "System Cooling Design for the Water-Cooled IBM Enterprise System/9000 Processors," IBM Research and Development, Vol. 36, No. 4, pg. 791, July 1992.
6. T. Elperin and G. Rudin, "Thermal Reliability of a Bilayer Slab Subjected to a Local Heat Source," Journal of Electronic Packaging - Transactions of the ASME, Vol. 116, pp. 37-43, March 1994.
7. R.C. Estes, "Thermal Design Considerations for COB Applications," Hybrid Circuits, Vol. 17, pp. 49-55, September 1988.
8. G.F. Goth, M.L. Zumbrunnen, and K.P. Moran, "Dual-Tapered Piston (DTP) Module Cooling for IBM Enterprise System/9000 Systems," IBM Research and Development, Vol. 36, No. 4, pg. 805, July 1992.
9. Richard B. Hetnarski, editor, Thermal Stresses I, Elsevier Science Publishers B.V., Amsterdam, The Netherlands, 1986.
10. Robert T. Howard, "Thermal Management Concepts in Microelectronic Packaging," ISHM Technical Monograph Series, ISHM, USA, 1984.
11. An-Yu Kuo, "Thermal Stresses at the Edge of a Bimetallic Thermostat," Journal of Applied Mechanics, Vol. 56, pp. 585-589, September 1989.
12. J.H. Lau, "Thermoelastic Problems for Electronic Packaging," Hybrid Circuits - Journal of the International Society for Hybrid Microelectronics, Vol. 25, Hewlett Packard Company, Palo Alto, California, USA, pp. 11-15, May 1991.
13. Victor Mishkevich and Ephraim Suhir, "Simplified Engineering Approach for the Evaluation of Thermally Induced Stresses in Bi-Material Microelectronic Structures," ASME - Structural Analysis in Microelectronics and Fiber Optics, Vol. 7, pp. 127-133, 1993.
14. D. Munz and Y.Y. Yang, "Stress Singularities at the Interface in Bonded Dissimilar Materials under Mechanical and Thermal Loading," ASME Journal of Applied Mechanics, Vol. 59, pp. 857-861, December 1992.
15. E. Suhir, "Stresses in Bimetal Thermostats," Journal of Applied Mechanics, Vol. 53, pp. 657-660, September 1986.
16. E. Suhir, "Advances in Thermal Modeling of Microelectronic Components and Systems," Thermal Stress Failures in Microelectronic Components - Review and Extension, Vol. 1, Chapter 5, Hemisphere Publishing Corporation, pp. 337-412, 1988.
17. E. Suhir, "An Approximate Analysis of Stresses in Multilayered Elastic Thin Films," ASME Journal of Applied Mechanics, Vol. 55, pp. 143-148, March 1988.
18. E. Suhir, "Interfacial Stresses in Bimetal Thermostats," Journal of Applied Mechanics, Vol. 56, pp. 595-600, September 1989.
19. c Superconducting Ceramics," Int. J. Solids Structures, Vol. 27, No. 8, pp. 1025-1034, 1991.
20. E. Suhir, "Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate," Journal of Electronic Packaging, Vol. 116, pp. 171-176, September 1994.
21. S.P. Timoshenko and J.N. Goodier, Theory of Elasticity, McGraw-Hill, New York, 3rd edition, 1970.
22. Wan-Lee Yin and James L. Dale, "The Effects of Adhesive Nonlinearity on Thermal Stress in Layered Components," Journal of Electronic Packaging, Vol. 116, pp. 105-109, June 1994.
23. R. Zeyfang, "Stresses and Strains in a Plate Bonded to a Substrate: Semiconductor Devices," Solid-State Electronics, Vol. 14, pp. 1035-1039, 1971.