Surface inspection system with automatic discrimination of microscratches and particles on chemical mechanical polished wafers

1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings

Volumn , Issue , 1999, Pages 139-142

  Moriyama, I ^a   Tanabe, Y ^a   Ishimaru, I ^a   Noguchi, M ^a   Mizukami, K ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANGULAR DISTRIBUTION; CHEMICAL MECHANICAL POLISHING; INSPECTION; INSPECTION EQUIPMENT; MANUFACTURE; SEMICONDUCTOR DEVICE MANUFACTURE; AUTOMATION; CHEMICAL POLISHING; INTEGRATED CIRCUIT MANUFACTURE; LASER APPLICATIONS; LIGHT SCATTERING; PARTICLES (PARTICULATE MATTER);

DISCRIMINATION RATES; INSPECTION TOOLS; LASER-SCATTERING TECHNIQUES; MICROSCRATCHES; POLISHED WAFERS; SURFACE INSPECTION SYSTEM;

SILICON WAFERS; CRYSTAL DEFECTS;

CHEMICAL-MECHANICAL POLISHING (CMP); MICROSCRATCHES; SEMICONDUCTOR WAFERS; SURFACE INSPECTION SYSTEMS;

EID: 0033326980     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.1999.808757     Document Type: Conference Paper

References (3)

1. K. Witt et al. "A post-oxide CMP cleaning method based up on APM chemistries ", Proc. of CMP-MIC, p35 1-359, I997
2. M. lkota et al. "New particle-inspection system for large CMP-planarizationprocessed metal layers", Proc. uf SPIE, vol. 3332, p. 336-345, 1998
3. G. Mie, "Beitraege zur Optik Trueber Meiden, speziell Kollidaler Metalloesungen", Ann. Phys. , ~0125, p377-452, 1908